Mouse-Team

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Mouse-Team

We have extensive experience in High Speed DDR3 Production. We can completely finish in the First Version.

 

Manufacturing Capability  In-Process Control Chart  Outgoing Quality Assurance  Case Timetable

 

PCB

We keep holding a consistent persistence of specialty and design on work of PCB manufacturing, not because of CAST consideration, but of board production, basic system regulation requirements and quality. With the option to cooperate with the board manufacturer to come up with the best solution for cost and quality.

 

Manufacturing Capability

Technology Description

Now

Under Development

Minimum Trace/Space (inner/outer)

5/5 mils

4/4 mils

Minimum Finished Hole Diameter

10 mils

6 mils

Maximum Aspect Ratio

8:1

10:1

Minimum Board Thickness - 4 Layer

16 mils

12 mils

Minimum Board Thickness - 6 Layer

24 mils

22 mils

Maximum Board Thickness

125 mils

125 mils

Minimum/Maximum Layer

2/16

up to 20

Minimum SMT Device Pitch

12 mils

10 mils

Minimum SMT Device Land Width

8 mils

6 mils

Board Flatness Tolerance

±0.7%

±0.5%

Layer to Layer Reg. Tolerance

±5 mils

±4 mils

Impedance Control

Partial

Full

Entek / Gold Plating

Yes

Yes

Board Size

20" * 20"

24" * 24"

 

In-Process Control Chart

 

Outgoing Quality Assurance

 

Case Timetable 

Classification/Layer

2 Layer 4 Layer 6 Layer 8 Layer 10 Layer 12 Layer
Regular Case 5-day 6-day 6-day 7-day 7-day 8-day
Urgent Case 2-day 3-day 4-day 4-day 5-day 6-day

 


Mouse-Team

  

ADD: 2F,No.39,Sec.3,Chung Shan Rd,Chung-Ho.City Taipei Hsien,Taiwan,R.O.C. TEL: 886-2-8221-3028  FAX: 886-945617024

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